Результаты исследований: Научные публикации в периодических изданиях › статья по материалам конференции › Рецензирование
Surface processing of amorphous optical materials by argon cluster ion beam. / Nikolaev, I. V.; Korobeishchikov, N. G.; Roenko, M. A. и др.
в: Journal of Physics: Conference Series, Том 1105, № 1, 012134, 28.11.2018.Результаты исследований: Научные публикации в периодических изданиях › статья по материалам конференции › Рецензирование
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TY - JOUR
T1 - Surface processing of amorphous optical materials by argon cluster ion beam
AU - Nikolaev, I. V.
AU - Korobeishchikov, N. G.
AU - Roenko, M. A.
AU - Antonenko, A. Kh
N1 - Publisher Copyright: © Published under licence by IOP Publishing Ltd.
PY - 2018/11/28
Y1 - 2018/11/28
N2 - The production of a high-quality surface of fused silica is an important task for advanced optical technologies. In this work, the surface of fused silica has been processed by argon cluster ion beam having mean cluster size N mean ranged from 180 to 1000 atoms/cluster and energy E ranged from 5 to 23.5 keV. The analysis of surface morphology using atomic force microscopy and the spectral power density (PSD) function shows a noticeable smoothing of roughness in different spatial frequency ranges, depending on the cluster ion parameters. To evaluate the processing efficiency, the dependence of the etching rate of SiO2 on the parameters of cluster ions has been investigated. It is shown that the etching rate v etch is determined by the energy per atom in the cluster E/N mean and it varies from 0.2 to 20 nm/min with an energy change from 5 to 130 eV/atom.
AB - The production of a high-quality surface of fused silica is an important task for advanced optical technologies. In this work, the surface of fused silica has been processed by argon cluster ion beam having mean cluster size N mean ranged from 180 to 1000 atoms/cluster and energy E ranged from 5 to 23.5 keV. The analysis of surface morphology using atomic force microscopy and the spectral power density (PSD) function shows a noticeable smoothing of roughness in different spatial frequency ranges, depending on the cluster ion parameters. To evaluate the processing efficiency, the dependence of the etching rate of SiO2 on the parameters of cluster ions has been investigated. It is shown that the etching rate v etch is determined by the energy per atom in the cluster E/N mean and it varies from 0.2 to 20 nm/min with an energy change from 5 to 130 eV/atom.
UR - http://www.scopus.com/inward/record.url?scp=85058226376&partnerID=8YFLogxK
U2 - 10.1088/1742-6596/1105/1/012134
DO - 10.1088/1742-6596/1105/1/012134
M3 - Conference article
AN - SCOPUS:85058226376
VL - 1105
JO - Journal of Physics: Conference Series
JF - Journal of Physics: Conference Series
SN - 1742-6588
IS - 1
M1 - 012134
T2 - 34th Siberian Thermophysical Seminar Dedicated to the 85th Anniversary of Academician A. K. Rebrov, STS 2018
Y2 - 27 August 2018 through 30 August 2018
ER -
ID: 17852215