Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование
Structural Changes in Nanometer-Thick Silicon-on-Insulator Films During High-Temperature Annealing. / Tyschenko, I. E.; Spesivtsev, E. V.; Shklyaev, A. A. и др.
в: Semiconductors, Том 56, № 3, 03.2022, стр. 223-229.Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование
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TY - JOUR
T1 - Structural Changes in Nanometer-Thick Silicon-on-Insulator Films During High-Temperature Annealing
AU - Tyschenko, I. E.
AU - Spesivtsev, E. V.
AU - Shklyaev, A. A.
AU - Popov, V. P.
N1 - Funding Information: The study was carried out under financial support of the Ministry of Education and Science of Russia (state assignment 0242-2021-0003). Publisher Copyright: © 2022, Pleiades Publishing, Ltd.
PY - 2022/3
Y1 - 2022/3
N2 - The thermal stability of silicon-on-insulator films with a thickness of 4.7 and 2.2 nm is studied as a function of annealing temperature in the range of Т = 800–1200°C by scanning electron microscopy and spectral ellipsometry. No signs of film melting were found; the films remain continuous over this annealing temperature range. A decrease in the thickness of the films and a change in their phase composition with an increase in temperature are discovered. According to the data of spectral ellipsometry, as the annealing temperature is increased, the content of the crystalline phase in the films decreases and the content of the amorphous phase increases. The activation energy of the process of film amorphization is estimated. The revealed properties are discussed from the viewpoint of diffusion of oxygen atoms into a silicon film and rearrangement of Si–Si bonds.
AB - The thermal stability of silicon-on-insulator films with a thickness of 4.7 and 2.2 nm is studied as a function of annealing temperature in the range of Т = 800–1200°C by scanning electron microscopy and spectral ellipsometry. No signs of film melting were found; the films remain continuous over this annealing temperature range. A decrease in the thickness of the films and a change in their phase composition with an increase in temperature are discovered. According to the data of spectral ellipsometry, as the annealing temperature is increased, the content of the crystalline phase in the films decreases and the content of the amorphous phase increases. The activation energy of the process of film amorphization is estimated. The revealed properties are discussed from the viewpoint of diffusion of oxygen atoms into a silicon film and rearrangement of Si–Si bonds.
KW - amorphization
KW - nanostructures
KW - silicon-on-insulator
KW - thermal stability
UR - http://www.scopus.com/inward/record.url?scp=85130210566&partnerID=8YFLogxK
UR - https://www.mendeley.com/catalogue/5135a360-40cb-32d3-b278-029aac015936/
U2 - 10.1134/S1063782622020166
DO - 10.1134/S1063782622020166
M3 - Article
AN - SCOPUS:85130210566
VL - 56
SP - 223
EP - 229
JO - Semiconductors
JF - Semiconductors
SN - 1063-7826
IS - 3
ER -
ID: 36167040