Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование
High-Temperature PIN Diodes Based on Amorphous Hydrogenated Silicon-Carbon Alloys and Boron-Doped Diamond Thin Films. / Stuchlikova, The Ha; Stuchlik, Jiri; Remes, Zdenek и др.
в: Physica Status Solidi (B) Basic Research, Том 257, № 6, 1900247, 01.06.2020.Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование
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TY - JOUR
T1 - High-Temperature PIN Diodes Based on Amorphous Hydrogenated Silicon-Carbon Alloys and Boron-Doped Diamond Thin Films
AU - Stuchlikova, The Ha
AU - Stuchlik, Jiri
AU - Remes, Zdenek
AU - Taylor, Andrew
AU - Mortet, Vincent
AU - Ashcheulov, Petr
AU - Gregora, Ivan
AU - Krivyakin, Grigoriy
AU - Volodin, Vladimir
N1 - Publisher Copyright: © 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
PY - 2020/6/1
Y1 - 2020/6/1
N2 - Amorphous SiC:H (a-SiC:H) diode structures with different ratios of Si:C are deposited on transparent conductive boron-doped diamond-coated fused silica substrates by plasma-enhanced chemical vapor deposition. The boron-doped diamond thin films have been deposited at temperature 720 °C on the fused silica substrates with a Ti grid used to enhance electrical conductivity. The thin-film structures based on P-type, Intrinsic and N-type a-SiC:H thin films, shortly a-SiC:H PIN diodes, are characterized by current–voltage measurements under solar simulator illumination. For comparison, the same PIN structures are deposited on fluorine-doped tin oxide. Before deposition of the diode structures, the surface morphology is studied by scanning electron microscopy, and undoped layers deposited on the quartz substrates are characterized by temperature-resolved electrical resistivity, optical absorptance, Raman spectroscopy, and photoluminescence.
AB - Amorphous SiC:H (a-SiC:H) diode structures with different ratios of Si:C are deposited on transparent conductive boron-doped diamond-coated fused silica substrates by plasma-enhanced chemical vapor deposition. The boron-doped diamond thin films have been deposited at temperature 720 °C on the fused silica substrates with a Ti grid used to enhance electrical conductivity. The thin-film structures based on P-type, Intrinsic and N-type a-SiC:H thin films, shortly a-SiC:H PIN diodes, are characterized by current–voltage measurements under solar simulator illumination. For comparison, the same PIN structures are deposited on fluorine-doped tin oxide. Before deposition of the diode structures, the surface morphology is studied by scanning electron microscopy, and undoped layers deposited on the quartz substrates are characterized by temperature-resolved electrical resistivity, optical absorptance, Raman spectroscopy, and photoluminescence.
KW - a-SiC:H
KW - boron-doped diamond
KW - fluorine-doped tin oxide
KW - I–V characteristics
KW - PIN diodes
KW - DENSITY
KW - PHOTOLUMINESCENCE
KW - CARBIDE
KW - H
KW - GAP STATES
KW - I-V characteristics
KW - a-SiC
UR - http://www.scopus.com/inward/record.url?scp=85083660309&partnerID=8YFLogxK
U2 - 10.1002/pssb.201900247
DO - 10.1002/pssb.201900247
M3 - Article
AN - SCOPUS:85083660309
VL - 257
JO - Physica Status Solidi (B): Basic Research
JF - Physica Status Solidi (B): Basic Research
SN - 0370-1972
IS - 6
M1 - 1900247
ER -
ID: 24075227