Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование
Growth of Bi2Se3/graphene heterostructures with the room temperature high carrier mobility. / Antonova, I. V.; Nebogatikova, N. A.; Stepina, N. P. и др.
в: Journal of Materials Science, Том 56, № 15, 05.2021, стр. 9330–9343.Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование
}
TY - JOUR
T1 - Growth of Bi2Se3/graphene heterostructures with the room temperature high carrier mobility
AU - Antonova, I. V.
AU - Nebogatikova, N. A.
AU - Stepina, N. P.
AU - Volodin, V. A.
AU - Kirienko, V. V.
AU - Rybin, M. G.
AU - Obrazstova, E. D.
AU - Golyashov, V. A.
AU - Kokh, K. A.
AU - Tereshchenko, O. E.
N1 - Funding Information: This work was supported by the RFBR Grant Nos. 18-29-12094 and 19-29-12061, the RSF Grant No. 20-42-08004 in the part of graphene synthesis, and state assignment of IGM SB RAS, ISP SB RAS and FSRG-2020-0017. The Raman spectra were registered using the equipment of the Center of collective usage “VTAN” in the ATRC department of NSU. Publisher Copyright: © 2021, The Author(s), under exclusive licence to Springer Science+Business Media, LLC part of Springer Nature. Copyright: Copyright 2021 Elsevier B.V., All rights reserved.
PY - 2021/5
Y1 - 2021/5
N2 - Heterostructures of Bi2Se3 topological insulators were epitaxially grown on graphene by means of the physical vapor deposition at 500 °C. Micrometer-sized flakes with thickness 1 QL (quintuple layer ~ 1 nm) and films of millimeter-scale with thicknesses 2–6 QL had been grown on CVD graphene. The minimum thickness of large-scaled continuous Bi2Se3 films was found to be ~ 8 QL for the regime used. The heterostructures with a Bi2Se3 film thickness of > 10 QL had resistivity as low as 200–500 Ω/sq and a high room temperature carrier mobility ~ 1000–3400 cm2/Vs in the Bi2Se3/graphene interface channel. Moreover, the coexistence of a p-type graphene-related conductive channel, simultaneously with the n-type conductive surface channel of Bi2Se3, was observed. The improvement of the bottom Bi2Se3/graphene interface with the increase in the growth time clearly manifested itself in the increase of conductivity and carrier mobility in the grown layer. The grown Bi2Se3/G structures have lower resistivities and more than one order of magnitude higher carrier mobilities in comparison with the van der Waals Bi2Se3/graphene heterostructures created employing exfoliation of thin Bi2Se3 layers. The grown heterostructures demonstrated the properties that are perspective for new functional devices, for a variety of signal processing and logic applications.
AB - Heterostructures of Bi2Se3 topological insulators were epitaxially grown on graphene by means of the physical vapor deposition at 500 °C. Micrometer-sized flakes with thickness 1 QL (quintuple layer ~ 1 nm) and films of millimeter-scale with thicknesses 2–6 QL had been grown on CVD graphene. The minimum thickness of large-scaled continuous Bi2Se3 films was found to be ~ 8 QL for the regime used. The heterostructures with a Bi2Se3 film thickness of > 10 QL had resistivity as low as 200–500 Ω/sq and a high room temperature carrier mobility ~ 1000–3400 cm2/Vs in the Bi2Se3/graphene interface channel. Moreover, the coexistence of a p-type graphene-related conductive channel, simultaneously with the n-type conductive surface channel of Bi2Se3, was observed. The improvement of the bottom Bi2Se3/graphene interface with the increase in the growth time clearly manifested itself in the increase of conductivity and carrier mobility in the grown layer. The grown Bi2Se3/G structures have lower resistivities and more than one order of magnitude higher carrier mobilities in comparison with the van der Waals Bi2Se3/graphene heterostructures created employing exfoliation of thin Bi2Se3 layers. The grown heterostructures demonstrated the properties that are perspective for new functional devices, for a variety of signal processing and logic applications.
UR - http://www.scopus.com/inward/record.url?scp=85101023129&partnerID=8YFLogxK
U2 - 10.1007/s10853-021-05836-y
DO - 10.1007/s10853-021-05836-y
M3 - Article
AN - SCOPUS:85101023129
VL - 56
SP - 9330
EP - 9343
JO - Journal of Materials Science
JF - Journal of Materials Science
SN - 0022-2461
IS - 15
ER -
ID: 27877178