Результаты исследований: Публикации в книгах, отчётах, сборниках, трудах конференций › статья в сборнике материалов конференции › научная › Рецензирование
Jet Density Dynamics During Shock Impact on Metal Plate Joints. / Khalemenchuk, Vyacheslav P.; Glushak, Anastasia A.; Rubtsov, Ivan A. и др.
International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM. IEEE Computer Society, 2024. стр. 950-953 (International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM).Результаты исследований: Публикации в книгах, отчётах, сборниках, трудах конференций › статья в сборнике материалов конференции › научная › Рецензирование
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TY - GEN
T1 - Jet Density Dynamics During Shock Impact on Metal Plate Joints
AU - Khalemenchuk, Vyacheslav P.
AU - Glushak, Anastasia A.
AU - Rubtsov, Ivan A.
AU - Ten, Konstantin A.
AU - Pruuel, Eduard R.
AU - Kashkarov, Alexey O.
N1 - Conference code: 25
PY - 2024
Y1 - 2024
N2 - This study investigated the ejection of microparticle flux (shock-wave dusting) from straight structural joints under strong shock loading from high-power energetic materials (EM). The joints were formed by plates from D16T aluminum alloy and M1 copper, with surface roughness not exceeding 1.6 μm. The process of microparticle injection was registered by synchrotron radiation (SR) pulse radiography from the VEPP-3 collider, which produces steady SR impulses with a duration of 1 ns and a period of 124 ns. A highly sensitive DIMEX detector with an aperture of 40 mm and a spatial resolution of 100 μm was used to record the X-ray shadow. The DIMEX detector is capable of recording an X-ray film of 100 frames. The X-ray shadow recording was performed along the flux of microparticles. To reestimate (calculate) the linear mass of the microparticle flux, the DIMEX detector was calibrated using aluminum and copper foils of different thicknesses. According to the results of measuring the position of the microparticle fluxes, it can be seen that there is a separation into high-density and low-density parts of the flux. The fluxes move at different velocities and as they move, they change their shape (elongate). The linear density distributions of the fluxes are given and their velocities are measured.
AB - This study investigated the ejection of microparticle flux (shock-wave dusting) from straight structural joints under strong shock loading from high-power energetic materials (EM). The joints were formed by plates from D16T aluminum alloy and M1 copper, with surface roughness not exceeding 1.6 μm. The process of microparticle injection was registered by synchrotron radiation (SR) pulse radiography from the VEPP-3 collider, which produces steady SR impulses with a duration of 1 ns and a period of 124 ns. A highly sensitive DIMEX detector with an aperture of 40 mm and a spatial resolution of 100 μm was used to record the X-ray shadow. The DIMEX detector is capable of recording an X-ray film of 100 frames. The X-ray shadow recording was performed along the flux of microparticles. To reestimate (calculate) the linear mass of the microparticle flux, the DIMEX detector was calibrated using aluminum and copper foils of different thicknesses. According to the results of measuring the position of the microparticle fluxes, it can be seen that there is a separation into high-density and low-density parts of the flux. The fluxes move at different velocities and as they move, they change their shape (elongate). The linear density distributions of the fluxes are given and their velocities are measured.
KW - X-ray detector
KW - dust fluxes
KW - flash radiography
KW - structural joints
KW - synchrotron radiation
UR - https://www.scopus.com/record/display.uri?eid=2-s2.0-85201931509&origin=inward&txGid=5e86fedcb6a63e580d625e88435a4fd2
UR - https://www.mendeley.com/catalogue/7bf1de6d-8dd2-360f-93d6-b069e4e00d10/
U2 - 10.1109/EDM61683.2024.10614979
DO - 10.1109/EDM61683.2024.10614979
M3 - Conference contribution
SN - 9798350389234
T3 - International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM
SP - 950
EP - 953
BT - International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM
PB - IEEE Computer Society
T2 - 25th IEEE International Conference of Young Professionals in Electron Devices and Materials
Y2 - 28 June 2024 through 2 July 2024
ER -
ID: 60550378