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Jet Density Dynamics During Shock Impact on Metal Plate Joints. / Khalemenchuk, Vyacheslav P.; Glushak, Anastasia A.; Rubtsov, Ivan A. et al.

International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM. IEEE Computer Society, 2024. p. 950-953 (International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM).

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Harvard

Khalemenchuk, VP, Glushak, AA, Rubtsov, IA, Ten, KA, Pruuel, ER & Kashkarov, AO 2024, Jet Density Dynamics During Shock Impact on Metal Plate Joints. in International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM. International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM, IEEE Computer Society, pp. 950-953, 25th IEEE International Conference of Young Professionals in Electron Devices and Materials, Russian Federation, 28.06.2024. https://doi.org/10.1109/EDM61683.2024.10614979

APA

Khalemenchuk, V. P., Glushak, A. A., Rubtsov, I. A., Ten, K. A., Pruuel, E. R., & Kashkarov, A. O. (2024). Jet Density Dynamics During Shock Impact on Metal Plate Joints. In International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM (pp. 950-953). (International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM). IEEE Computer Society. https://doi.org/10.1109/EDM61683.2024.10614979

Vancouver

Khalemenchuk VP, Glushak AA, Rubtsov IA, Ten KA, Pruuel ER, Kashkarov AO. Jet Density Dynamics During Shock Impact on Metal Plate Joints. In International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM. IEEE Computer Society. 2024. p. 950-953. (International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM). doi: 10.1109/EDM61683.2024.10614979

Author

Khalemenchuk, Vyacheslav P. ; Glushak, Anastasia A. ; Rubtsov, Ivan A. et al. / Jet Density Dynamics During Shock Impact on Metal Plate Joints. International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM. IEEE Computer Society, 2024. pp. 950-953 (International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM).

BibTeX

@inproceedings{d6ade486039f41949055a6abfb6b5f32,
title = "Jet Density Dynamics During Shock Impact on Metal Plate Joints",
abstract = "This study investigated the ejection of microparticle flux (shock-wave dusting) from straight structural joints under strong shock loading from high-power energetic materials (EM). The joints were formed by plates from D16T aluminum alloy and M1 copper, with surface roughness not exceeding 1.6 μm. The process of microparticle injection was registered by synchrotron radiation (SR) pulse radiography from the VEPP-3 collider, which produces steady SR impulses with a duration of 1 ns and a period of 124 ns. A highly sensitive DIMEX detector with an aperture of 40 mm and a spatial resolution of 100 μm was used to record the X-ray shadow. The DIMEX detector is capable of recording an X-ray film of 100 frames. The X-ray shadow recording was performed along the flux of microparticles. To reestimate (calculate) the linear mass of the microparticle flux, the DIMEX detector was calibrated using aluminum and copper foils of different thicknesses. According to the results of measuring the position of the microparticle fluxes, it can be seen that there is a separation into high-density and low-density parts of the flux. The fluxes move at different velocities and as they move, they change their shape (elongate). The linear density distributions of the fluxes are given and their velocities are measured.",
keywords = "X-ray detector, dust fluxes, flash radiography, structural joints, synchrotron radiation",
author = "Khalemenchuk, {Vyacheslav P.} and Glushak, {Anastasia A.} and Rubtsov, {Ivan A.} and Ten, {Konstantin A.} and Pruuel, {Eduard R.} and Kashkarov, {Alexey O.}",
year = "2024",
doi = "10.1109/EDM61683.2024.10614979",
language = "English",
isbn = "9798350389234",
series = "International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM",
publisher = "IEEE Computer Society",
pages = "950--953",
booktitle = "International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM",
address = "United States",
note = "25th IEEE International Conference of Young Professionals in Electron Devices and Materials, EDM 2024 ; Conference date: 28-06-2024 Through 02-07-2024",
url = "https://edm.ieeesiberia.org/",

}

RIS

TY - GEN

T1 - Jet Density Dynamics During Shock Impact on Metal Plate Joints

AU - Khalemenchuk, Vyacheslav P.

AU - Glushak, Anastasia A.

AU - Rubtsov, Ivan A.

AU - Ten, Konstantin A.

AU - Pruuel, Eduard R.

AU - Kashkarov, Alexey O.

N1 - Conference code: 25

PY - 2024

Y1 - 2024

N2 - This study investigated the ejection of microparticle flux (shock-wave dusting) from straight structural joints under strong shock loading from high-power energetic materials (EM). The joints were formed by plates from D16T aluminum alloy and M1 copper, with surface roughness not exceeding 1.6 μm. The process of microparticle injection was registered by synchrotron radiation (SR) pulse radiography from the VEPP-3 collider, which produces steady SR impulses with a duration of 1 ns and a period of 124 ns. A highly sensitive DIMEX detector with an aperture of 40 mm and a spatial resolution of 100 μm was used to record the X-ray shadow. The DIMEX detector is capable of recording an X-ray film of 100 frames. The X-ray shadow recording was performed along the flux of microparticles. To reestimate (calculate) the linear mass of the microparticle flux, the DIMEX detector was calibrated using aluminum and copper foils of different thicknesses. According to the results of measuring the position of the microparticle fluxes, it can be seen that there is a separation into high-density and low-density parts of the flux. The fluxes move at different velocities and as they move, they change their shape (elongate). The linear density distributions of the fluxes are given and their velocities are measured.

AB - This study investigated the ejection of microparticle flux (shock-wave dusting) from straight structural joints under strong shock loading from high-power energetic materials (EM). The joints were formed by plates from D16T aluminum alloy and M1 copper, with surface roughness not exceeding 1.6 μm. The process of microparticle injection was registered by synchrotron radiation (SR) pulse radiography from the VEPP-3 collider, which produces steady SR impulses with a duration of 1 ns and a period of 124 ns. A highly sensitive DIMEX detector with an aperture of 40 mm and a spatial resolution of 100 μm was used to record the X-ray shadow. The DIMEX detector is capable of recording an X-ray film of 100 frames. The X-ray shadow recording was performed along the flux of microparticles. To reestimate (calculate) the linear mass of the microparticle flux, the DIMEX detector was calibrated using aluminum and copper foils of different thicknesses. According to the results of measuring the position of the microparticle fluxes, it can be seen that there is a separation into high-density and low-density parts of the flux. The fluxes move at different velocities and as they move, they change their shape (elongate). The linear density distributions of the fluxes are given and their velocities are measured.

KW - X-ray detector

KW - dust fluxes

KW - flash radiography

KW - structural joints

KW - synchrotron radiation

UR - https://www.scopus.com/record/display.uri?eid=2-s2.0-85201931509&origin=inward&txGid=5e86fedcb6a63e580d625e88435a4fd2

UR - https://www.mendeley.com/catalogue/7bf1de6d-8dd2-360f-93d6-b069e4e00d10/

U2 - 10.1109/EDM61683.2024.10614979

DO - 10.1109/EDM61683.2024.10614979

M3 - Conference contribution

SN - 9798350389234

T3 - International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM

SP - 950

EP - 953

BT - International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, EDM

PB - IEEE Computer Society

T2 - 25th IEEE International Conference of Young Professionals in Electron Devices and Materials

Y2 - 28 June 2024 through 2 July 2024

ER -

ID: 60550378