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Implementation of Terahertz High-Pass Filters Based on All-Metal Microstructures using Deep X-ray Lithography. / Gentselev, A. N.; Kuznetsov, S. A.; Dultsev, F. N. et al.

In: Optoelectronics, Instrumentation and Data Processing, Vol. 55, No. 2, 01.03.2019, p. 115-125.

Research output: Contribution to journal › Article › peer-review

Harvard

Gentselev, AN, Kuznetsov, SA, Dultsev, FN, Goldenberg, BG, Zelinsky, AG, Kondratyev, VI & Tanygina, DS 2019, 'Implementation of Terahertz High-Pass Filters Based on All-Metal Microstructures using Deep X-ray Lithography', Optoelectronics, Instrumentation and Data Processing, vol. 55, no. 2, pp. 115-125. https://doi.org/10.3103/S875669901902002X

APA

Gentselev, A. N., Kuznetsov, S. A., Dultsev, F. N., Goldenberg, B. G., Zelinsky, A. G., Kondratyev, V. I., & Tanygina, D. S. (2019). Implementation of Terahertz High-Pass Filters Based on All-Metal Microstructures using Deep X-ray Lithography. Optoelectronics, Instrumentation and Data Processing, 55(2), 115-125. https://doi.org/10.3103/S875669901902002X

Vancouver

Gentselev AN, Kuznetsov SA, Dultsev FN, Goldenberg BG, Zelinsky AG, Kondratyev VI et al. Implementation of Terahertz High-Pass Filters Based on All-Metal Microstructures using Deep X-ray Lithography. Optoelectronics, Instrumentation and Data Processing. 2019 Mar 1;55(2):115-125. doi: 10.3103/S875669901902002X

Author

Gentselev, A. N. ; Kuznetsov, S. A. ; Dultsev, F. N. et al. / Implementation of Terahertz High-Pass Filters Based on All-Metal Microstructures using Deep X-ray Lithography. In: Optoelectronics, Instrumentation and Data Processing. 2019 ; Vol. 55, No. 2. pp. 115-125.

BibTeX

@article{681fe967888c468abb665ebf4753ee9b,
title = "Implementation of Terahertz High-Pass Filters Based on All-Metal Microstructures using Deep X-ray Lithography",
abstract = "A method for fabricating high-pass terahertz quasi-optical filters in the form of thick (up to 1 mm in thickness) self-bearing copper microstructures of subwavelength topology is described. This method is based on forming a high-aspect-ratio mask of SU-8 resist on a silicon wafer via deep X-ray lithography through a tungsten X-ray mask followed by electroplating a copper layer through the resistive mask. An example of a 212-µm thick structure with a cutoff frequency of 0.42 THz having the geometry of hexagon-shaped through-holes arranged on a triangular lattice is considered. The results of broadband THz characterization and electromagnetic analysis of the structure fabricated are presented.",
keywords = "deep X-ray lithography, LIGA technology, microstructures, quasi-optical filters, terahertz range, SUBTERAHERTZ, TUNGSTEN",
author = "Gentselev, {A. N.} and Kuznetsov, {S. A.} and Dultsev, {F. N.} and Goldenberg, {B. G.} and Zelinsky, {A. G.} and Kondratyev, {V. I.} and Tanygina, {D. S.}",
note = "Publisher Copyright: {\textcopyright} 2019, Allerton Press, Inc.",
year = "2019",
month = mar,
day = "1",
doi = "10.3103/S875669901902002X",
language = "English",
volume = "55",
pages = "115--125",
journal = "Optoelectronics, Instrumentation and Data Processing",
issn = "8756-6990",
publisher = "Allerton Press Inc.",
number = "2",

}

RIS

TY - JOUR

T1 - Implementation of Terahertz High-Pass Filters Based on All-Metal Microstructures using Deep X-ray Lithography

AU - Gentselev, A. N.

AU - Kuznetsov, S. A.

AU - Dultsev, F. N.

AU - Goldenberg, B. G.

AU - Zelinsky, A. G.

AU - Kondratyev, V. I.

AU - Tanygina, D. S.

N1 - Publisher Copyright: © 2019, Allerton Press, Inc.

PY - 2019/3/1

Y1 - 2019/3/1

N2 - A method for fabricating high-pass terahertz quasi-optical filters in the form of thick (up to 1 mm in thickness) self-bearing copper microstructures of subwavelength topology is described. This method is based on forming a high-aspect-ratio mask of SU-8 resist on a silicon wafer via deep X-ray lithography through a tungsten X-ray mask followed by electroplating a copper layer through the resistive mask. An example of a 212-µm thick structure with a cutoff frequency of 0.42 THz having the geometry of hexagon-shaped through-holes arranged on a triangular lattice is considered. The results of broadband THz characterization and electromagnetic analysis of the structure fabricated are presented.

AB - A method for fabricating high-pass terahertz quasi-optical filters in the form of thick (up to 1 mm in thickness) self-bearing copper microstructures of subwavelength topology is described. This method is based on forming a high-aspect-ratio mask of SU-8 resist on a silicon wafer via deep X-ray lithography through a tungsten X-ray mask followed by electroplating a copper layer through the resistive mask. An example of a 212-µm thick structure with a cutoff frequency of 0.42 THz having the geometry of hexagon-shaped through-holes arranged on a triangular lattice is considered. The results of broadband THz characterization and electromagnetic analysis of the structure fabricated are presented.

KW - deep X-ray lithography

KW - LIGA technology

KW - microstructures

KW - quasi-optical filters

KW - terahertz range

KW - SUBTERAHERTZ

KW - TUNGSTEN

UR - http://www.scopus.com/inward/record.url?scp=85067345698&partnerID=8YFLogxK

U2 - 10.3103/S875669901902002X

DO - 10.3103/S875669901902002X

M3 - Article

AN - SCOPUS:85067345698

VL - 55

SP - 115

EP - 125

JO - Optoelectronics, Instrumentation and Data Processing

JF - Optoelectronics, Instrumentation and Data Processing

SN - 8756-6990

IS - 2

ER -

ID: 20588637