Research output: Contribution to journal › Article › peer-review
Electric current-assisted joining of copper plates using silver formed by in-situ decomposition of Ag2C2O4. / Dudina, Dina V.; Matvienko, Alexander A.; Sidelnikov, Anatoly A. et al.
In: Metals, Vol. 8, No. 7, 538, 12.07.2018.Research output: Contribution to journal › Article › peer-review
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TY - JOUR
T1 - Electric current-assisted joining of copper plates using silver formed by in-situ decomposition of Ag2C2O4
AU - Dudina, Dina V.
AU - Matvienko, Alexander A.
AU - Sidelnikov, Anatoly A.
AU - Legan, Mikhail A.
AU - Mali, Vyacheslav I.
AU - Esikov, Maksim A.
AU - Anisimov, Alexander G.
AU - Gribov, Pavel A.
AU - Boldyrev, Vladimir V.
PY - 2018/7/12
Y1 - 2018/7/12
N2 - Pulsed electric current can be used for the fast sintering of powders as well as joining of macroobjects. In this work, we brazed copper plates using a silver layer that was formed in situ by the decomposition of a silver oxalate Ag2C2O4 powder placed between the plates. Joining was conducted in the chamber of a Spark Plasma Sintering (SPS) facility with and without a graphite die. In the die-assisted tooling configuration, indirect heating of the assembly from the graphite die carrying electric current occurred until the brazing layer transformed into metallic silver. The passage of electric current through a Cu/Ag2C2O4/Cu stack placed between the electrodes without a die was possible because of the formation of Cu/Cu contacts in the areas free from the Ag2C2O4 particles. Joints that were formed in the die-assisted experiments showed a slightly higher shear strength (45 MPa) in comparison with joints formed without a die (41 MPa). The shear strength of the reference sample (obtained without a die), a stack of copper plates joined without any brazing layer, was only 31 MPa, which indicates a key role of the silver in producing strong bonding between the plates. This study shows that both die-assisted tooling configurations and those without a die can be used for the SPS brazing of materials by the oxalate-derived silver interlayer.
AB - Pulsed electric current can be used for the fast sintering of powders as well as joining of macroobjects. In this work, we brazed copper plates using a silver layer that was formed in situ by the decomposition of a silver oxalate Ag2C2O4 powder placed between the plates. Joining was conducted in the chamber of a Spark Plasma Sintering (SPS) facility with and without a graphite die. In the die-assisted tooling configuration, indirect heating of the assembly from the graphite die carrying electric current occurred until the brazing layer transformed into metallic silver. The passage of electric current through a Cu/Ag2C2O4/Cu stack placed between the electrodes without a die was possible because of the formation of Cu/Cu contacts in the areas free from the Ag2C2O4 particles. Joints that were formed in the die-assisted experiments showed a slightly higher shear strength (45 MPa) in comparison with joints formed without a die (41 MPa). The shear strength of the reference sample (obtained without a die), a stack of copper plates joined without any brazing layer, was only 31 MPa, which indicates a key role of the silver in producing strong bonding between the plates. This study shows that both die-assisted tooling configurations and those without a die can be used for the SPS brazing of materials by the oxalate-derived silver interlayer.
KW - Copper
KW - Decomposition
KW - Electric current
KW - Joining
KW - Silver oxalate
KW - Spark Plasma Sintering
KW - electric current
KW - joining
KW - copper
KW - decomposition
KW - silver oxalate
UR - http://www.scopus.com/inward/record.url?scp=85050510268&partnerID=8YFLogxK
U2 - 10.3390/met8070538
DO - 10.3390/met8070538
M3 - Article
AN - SCOPUS:85050510268
VL - 8
JO - Metals
JF - Metals
SN - 2075-4701
IS - 7
M1 - 538
ER -
ID: 15959002