Cu/synthetic and impact-diamond composite heat-conducting substrates

Standard

Cu/synthetic and impact-diamond composite heat-conducting substrates. / Galashov, E. N.; Yusuf, A. A.; Mandrik, E. M.

In: Journal of Physics: Conference Series, Vol. 690, No. 1, 012043, 26.02.2016.

Research output: Contribution to journal › Conference article › peer-review

Harvard

Galashov, EN, Yusuf, AA & Mandrik, EM 2016, 'Cu/synthetic and impact-diamond composite heat-conducting substrates', Journal of Physics: Conference Series, vol. 690, no. 1, 012043. https://doi.org/10.1088/1742-6596/690/1/012043

APA

Galashov, E. N., Yusuf, A. A., & Mandrik, E. M. (2016). Cu/synthetic and impact-diamond composite heat-conducting substrates. Journal of Physics: Conference Series, 690(1), [012043]. https://doi.org/10.1088/1742-6596/690/1/012043

Vancouver

Galashov EN, Yusuf AA, Mandrik EM. Cu/synthetic and impact-diamond composite heat-conducting substrates. Journal of Physics: Conference Series. 2016 Feb 26;690(1):012043. doi: 10.1088/1742-6596/690/1/012043

Author

Galashov, E. N. ; Yusuf, A. A. ; Mandrik, E. M. / Cu/synthetic and impact-diamond composite heat-conducting substrates. In: Journal of Physics: Conference Series. 2016 ; Vol. 690, No. 1.

BibTeX

@article{5a415da37bfb43108efc77374e80d148,

title = "Cu/synthetic and impact-diamond composite heat-conducting substrates",

abstract = "Composite material with high thermal conductivity was obtained by the method of thermal sintering of diamonds (synthetic and impact) and copper powder and by further hot isostatic pressing. The content of diamond (the particle size is 20 - 250 μm) in the diamond copper composite was 30 - 45 weight percent. The coefficient of thermal conductivity of copper diamond composite materials based on synthetic diamonds was measured to be 700 - 750 Wm-1K-1. The coefficient of thermal conductivity of copper diamond composite materials based on impact diamonds was measured to be 850 - 900 Wm-1 K-1. The coefficient of thermal expansion (CTE) was measured to be 5.5 - 6.5 • 10-6/°C for synthetic diamonds and 6.1 - 6.5 •10-6/°C for impact diamonds. The obtained copper diamond composite materials are promising to be used as crystal holders for semiconductor crystals in THz and microwave devices.",

author = "Galashov, {E. N.} and Yusuf, {A. A.} and Mandrik, {E. M.}",

note = "Publisher Copyright: {\textcopyright} Published under licence by IOP Publishing Ltd. Copyright: Copyright 2018 Elsevier B.V., All rights reserved.; 17th Russian Youth Conference on Physics of Semiconductors and Nanostructures, Opto- and Nanoelectronics, RYCPS 2015 ; Conference date: 23-11-2015 Through 27-11-2015",

year = "2016",

month = feb,

day = "26",

doi = "10.1088/1742-6596/690/1/012043",

language = "English",

volume = "690",

journal = "Journal of Physics: Conference Series",

issn = "1742-6588",

publisher = "IOP Publishing Ltd.",

number = "1",

}

RIS

TY - JOUR

T1 - Cu/synthetic and impact-diamond composite heat-conducting substrates

AU - Galashov, E. N.

AU - Yusuf, A. A.

AU - Mandrik, E. M.

PY - 2016/2/26

Y1 - 2016/2/26

N2 - Composite material with high thermal conductivity was obtained by the method of thermal sintering of diamonds (synthetic and impact) and copper powder and by further hot isostatic pressing. The content of diamond (the particle size is 20 - 250 μm) in the diamond copper composite was 30 - 45 weight percent. The coefficient of thermal conductivity of copper diamond composite materials based on synthetic diamonds was measured to be 700 - 750 Wm-1K-1. The coefficient of thermal conductivity of copper diamond composite materials based on impact diamonds was measured to be 850 - 900 Wm-1 K-1. The coefficient of thermal expansion (CTE) was measured to be 5.5 - 6.5 • 10-6/°C for synthetic diamonds and 6.1 - 6.5 •10-6/°C for impact diamonds. The obtained copper diamond composite materials are promising to be used as crystal holders for semiconductor crystals in THz and microwave devices.

AB - Composite material with high thermal conductivity was obtained by the method of thermal sintering of diamonds (synthetic and impact) and copper powder and by further hot isostatic pressing. The content of diamond (the particle size is 20 - 250 μm) in the diamond copper composite was 30 - 45 weight percent. The coefficient of thermal conductivity of copper diamond composite materials based on synthetic diamonds was measured to be 700 - 750 Wm-1K-1. The coefficient of thermal conductivity of copper diamond composite materials based on impact diamonds was measured to be 850 - 900 Wm-1 K-1. The coefficient of thermal expansion (CTE) was measured to be 5.5 - 6.5 • 10-6/°C for synthetic diamonds and 6.1 - 6.5 •10-6/°C for impact diamonds. The obtained copper diamond composite materials are promising to be used as crystal holders for semiconductor crystals in THz and microwave devices.

UR - http://www.scopus.com/inward/record.url?scp=84964963573&partnerID=8YFLogxK

U2 - 10.1088/1742-6596/690/1/012043

DO - 10.1088/1742-6596/690/1/012043

M3 - Conference article

AN - SCOPUS:84964963573

VL - 690

JO - Journal of Physics: Conference Series

JF - Journal of Physics: Conference Series

SN - 1742-6588

IS - 1

M1 - 012043

T2 - 17th Russian Youth Conference on Physics of Semiconductors and Nanostructures, Opto- and Nanoelectronics, RYCPS 2015

Y2 - 23 November 2015 through 27 November 2015

ER -

ID: 27549174