Standard

Cu/Diamond composite heat-conducting shims. / Galashov, E. N.; Yusuf, A. A.; Mandrik, E. M.

In: Journal of Physics: Conference Series, Vol. 643, No. 1, 012089, 02.11.2015.

Research output: Contribution to journal › Conference article › peer-review

Harvard

Galashov, EN, Yusuf, AA & Mandrik, EM 2015, 'Cu/Diamond composite heat-conducting shims', Journal of Physics: Conference Series, vol. 643, no. 1, 012089. https://doi.org/10.1088/1742-6596/643/1/012089

APA

Galashov, E. N., Yusuf, A. A., & Mandrik, E. M. (2015). Cu/Diamond composite heat-conducting shims. Journal of Physics: Conference Series, 643(1), [012089]. https://doi.org/10.1088/1742-6596/643/1/012089

Vancouver

Galashov EN, Yusuf AA, Mandrik EM. Cu/Diamond composite heat-conducting shims. Journal of Physics: Conference Series. 2015 Nov 2;643(1):012089. doi: 10.1088/1742-6596/643/1/012089

Author

Galashov, E. N. ; Yusuf, A. A. ; Mandrik, E. M. / Cu/Diamond composite heat-conducting shims. In: Journal of Physics: Conference Series. 2015 ; Vol. 643, No. 1.

BibTeX

@article{e13e92b7748e44c08545e78b7c66092f,
title = "Cu/Diamond composite heat-conducting shims",
abstract = "Composite material with high thermal conductivity was obtained by the method of thermal sintering of a diamond (50 - 75%) with a size of 20 to 250 μm in a matrix of copper.Coefficient of thermal conductivity of copper diamond composite materials was measured and is 450 - 650 W•m-1•K-1. The coefficient of thermal expansion CTE was measured and is 5.5 - 7.5 • 10-6/°C. The obtained copper diamond composite materials are promising objects for use in THz and microwave devices.",
author = "Galashov, {E. N.} and Yusuf, {A. A.} and Mandrik, {E. M.}",
note = "Copyright: Copyright 2018 Elsevier B.V., All rights reserved.; 2nd International School and Conference Saint-Petersburg OPEN on Optoelectronics, Photonics, Engineering and Nanostructures, SPbOPEN 2015 ; Conference date: 06-04-2015 Through 08-04-2015",
year = "2015",
month = nov,
day = "2",
doi = "10.1088/1742-6596/643/1/012089",
language = "English",
volume = "643",
journal = "Journal of Physics: Conference Series",
issn = "1742-6588",
publisher = "IOP Publishing Ltd.",
number = "1",

}

RIS

TY - JOUR

T1 - Cu/Diamond composite heat-conducting shims

AU - Galashov, E. N.

AU - Yusuf, A. A.

AU - Mandrik, E. M.

N1 - Copyright: Copyright 2018 Elsevier B.V., All rights reserved.

PY - 2015/11/2

Y1 - 2015/11/2

N2 - Composite material with high thermal conductivity was obtained by the method of thermal sintering of a diamond (50 - 75%) with a size of 20 to 250 μm in a matrix of copper.Coefficient of thermal conductivity of copper diamond composite materials was measured and is 450 - 650 W•m-1•K-1. The coefficient of thermal expansion CTE was measured and is 5.5 - 7.5 • 10-6/°C. The obtained copper diamond composite materials are promising objects for use in THz and microwave devices.

AB - Composite material with high thermal conductivity was obtained by the method of thermal sintering of a diamond (50 - 75%) with a size of 20 to 250 μm in a matrix of copper.Coefficient of thermal conductivity of copper diamond composite materials was measured and is 450 - 650 W•m-1•K-1. The coefficient of thermal expansion CTE was measured and is 5.5 - 7.5 • 10-6/°C. The obtained copper diamond composite materials are promising objects for use in THz and microwave devices.

UR - http://www.scopus.com/inward/record.url?scp=84952919302&partnerID=8YFLogxK

U2 - 10.1088/1742-6596/643/1/012089

DO - 10.1088/1742-6596/643/1/012089

M3 - Conference article

AN - SCOPUS:84952919302

VL - 643

JO - Journal of Physics: Conference Series

JF - Journal of Physics: Conference Series

SN - 1742-6588

IS - 1

M1 - 012089

T2 - 2nd International School and Conference Saint-Petersburg OPEN on Optoelectronics, Photonics, Engineering and Nanostructures, SPbOPEN 2015

Y2 - 6 April 2015 through 8 April 2015

ER -

ID: 27432285