Original languageEnglish
Title of host publication2025 31st International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-3
Number of pages3
ISBN (Print)9798331526955
DOIs
Publication statusPublished - 26 Nov 2025
Event31st International Symposium on Discharges and Electrical Insulation in Vacuum - Chengdu, China
Duration: 21 Sept 202526 Sept 2025
Conference number: 31

Conference

Conference31st International Symposium on Discharges and Electrical Insulation in Vacuum
Abbreviated titleISDEIV
Country/TerritoryChina
CityChengdu
Period21.09.202526.09.2025

    OECD FOS+WOS

  • 1.03.UH PHYSICS, ATOMIC, MOLECULAR & CHEMICAL

ID: 75562984