TY - JOUR

T1 - Subcooled jet impingement boiling enhanced by porous surface with microcolumn array

AU - Zheng, Wenxiu

AU - Chen, Tiefeng

AU - Sen, Palash

AU - Gatapova, Elizaveta Ya

AU - Kabov, Oleg A.

AU - Bai, Bofeng

N1 - Funding Information: The authors gratefully acknowledge the financial support from the Ministry of Science and Technology of the People’s Republic of China (2017YFE0100600), Shaanxi Science and Technology Department (2021KWZ-15) and Ministry of Education and Science of the Russian Federation (Agreement 14.613.21.0067, Project Identifier RFMEFI61317X0067). Publisher Copyright: © 2021 by Begell House, Inc. Copyright: Copyright 2021 Elsevier B.V., All rights reserved.

PY - 2021

Y1 - 2021

N2 - Thermal management of electronic devices has been a key problem, especially as the heat flux of these devices increases continuously. Jet impingement boiling is an effective cooling technique for electronic devices, the enhancement of which still remains an urgent requirement. In particular, lowering the wall temperature and increasing the critical heat flux (CHF) are known to enhance cooling performance. In this paper, we propose a new jet impingement cooling method: applying the porous surface with a microcolumn array. This special porous structure is fabricated via the template method by using nano/microparticles. The enhancements of the jet impingement cooling performance with deionized water on the porous surfaces are investigated. The CHF and the heat transfer coefficient (HTC) increase with decreasing distance between the microcolumns. A high CHF of 548 W/cm2 is attained at the wall superheat of 34.5°C, and 36% enhancement is gained compared with the smooth porous surface. Meanwhile, a maximum HTC of 8.63 W/(cm2 K) is achieved, two and a half times as large as that on the smooth copper surface. To understand the underlying mechanism, we analyze the bubble diameter during the growth time and the bubble departure time. On the porous surface with microcolumn array, the bubble grows and departs faster due to the extra contact line and microlayer area. The thermal resistance at the edge of the microlayer can be extremely small, and the evaporation of the thin film accelerates the growth and departure of the bubble.

AB - Thermal management of electronic devices has been a key problem, especially as the heat flux of these devices increases continuously. Jet impingement boiling is an effective cooling technique for electronic devices, the enhancement of which still remains an urgent requirement. In particular, lowering the wall temperature and increasing the critical heat flux (CHF) are known to enhance cooling performance. In this paper, we propose a new jet impingement cooling method: applying the porous surface with a microcolumn array. This special porous structure is fabricated via the template method by using nano/microparticles. The enhancements of the jet impingement cooling performance with deionized water on the porous surfaces are investigated. The CHF and the heat transfer coefficient (HTC) increase with decreasing distance between the microcolumns. A high CHF of 548 W/cm2 is attained at the wall superheat of 34.5°C, and 36% enhancement is gained compared with the smooth porous surface. Meanwhile, a maximum HTC of 8.63 W/(cm2 K) is achieved, two and a half times as large as that on the smooth copper surface. To understand the underlying mechanism, we analyze the bubble diameter during the growth time and the bubble departure time. On the porous surface with microcolumn array, the bubble grows and departs faster due to the extra contact line and microlayer area. The thermal resistance at the edge of the microlayer can be extremely small, and the evaporation of the thin film accelerates the growth and departure of the bubble.

KW - Bubble growth

KW - Heat transfer enhancement

KW - Jet impingement boiling

KW - Porous surface

UR - http://www.scopus.com/inward/record.url?scp=85110575671&partnerID=8YFLogxK

U2 - 10.1615/JENHHEATTRANSF.2021037565

DO - 10.1615/JENHHEATTRANSF.2021037565

M3 - Article

AN - SCOPUS:85110575671

VL - 28

SP - 1

EP - 17

JO - Journal of Enhanced Heat Transfer

JF - Journal of Enhanced Heat Transfer

SN - 1065-5131

IS - 5

ER -