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Measurements of the Thin Liquid Droplet thickness by the Schlieren Method. / Пещенюк, Юлия Александровна; Семенов, Андрей Александрович; Шатский, Евгений Николаевич и др.

28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Institute of Electrical and Electronics Engineers (IEEE), 2022.

Результаты исследований: Публикации в книгах, отчётах, сборниках, трудах конференций › статья в сборнике материалов конференции › научная › Рецензирование

Harvard

Пещенюк, ЮА, Семенов, АА, Шатский, ЕН, Ayvazyan, GY & Гатапова, ЕЯ 2022, Measurements of the Thin Liquid Droplet thickness by the Schlieren Method. в 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/THERMINIC57263.2022.9950648

APA

Пещенюк, Ю. А., Семенов, А. А., Шатский, Е. Н., Ayvazyan, G. Y., & Гатапова, Е. Я. (2022). Measurements of the Thin Liquid Droplet thickness by the Schlieren Method. в 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/THERMINIC57263.2022.9950648

Vancouver

Пещенюк ЮА, Семенов АА, Шатский ЕН, Ayvazyan GY, Гатапова ЕЯ. Measurements of the Thin Liquid Droplet thickness by the Schlieren Method. в 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Institute of Electrical and Electronics Engineers (IEEE). 2022 doi: 10.1109/THERMINIC57263.2022.9950648

Author

Пещенюк, Юлия Александровна ; Семенов, Андрей Александрович ; Шатский, Евгений Николаевич и др. / Measurements of the Thin Liquid Droplet thickness by the Schlieren Method. 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Institute of Electrical and Electronics Engineers (IEEE), 2022.

BibTeX

@inproceedings{5bcc43c9ff4f44d0978f2893d4c72c91,
title = "Measurements of the Thin Liquid Droplet thickness by the Schlieren Method",
abstract = "The dynamics of thin liquid drops evaporating from structured surfaces is of fundamental importance in the study of heat transfer from such surfaces. This work is devoted to the study of the thickness of a sessile water drop during evaporation from a solid substrate. Black silicon was used as a substrate, the average absorbance of which in the wavelength range of 300–750 nm is 94%. The change in the droplet thickness during evaporation was studied by the Schlieren method with a stepped filter. For this purpose, a method for processing the obtained schlieren images was developed and tested in MATLAB. This method makes it possible to calculate droplet profiles, their surface area and volume. Based on the data obtained, the specific mass flow rate from the liquid surface and the speed of the contact line were determined.",
keywords = "droplet, evaporation, profile, schlieren method",
author = "Пещенюк, {Юлия Александровна} and Семенов, {Андрей Александрович} and Шатский, {Евгений Николаевич} and Ayvazyan, {Gagik Y.} and Гатапова, {Елизавета Яковлевна}",
note = "The study was supported by Russian Science Foundation (project 20-19-00722), characterization of the wetting properties of the black silicon was supported by the state contract with IT SB RAS (121031800213-0) on the KRUSS DSA-100E of large-scale research facilities “TGD complex IT SB RAS” ",
year = "2022",
doi = "10.1109/THERMINIC57263.2022.9950648",
language = "English",
isbn = "9781665492294",
booktitle = "28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)",
publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

}

RIS

TY - GEN

T1 - Measurements of the Thin Liquid Droplet thickness by the Schlieren Method

AU - Пещенюк, Юлия Александровна

AU - Семенов, Андрей Александрович

AU - Шатский, Евгений Николаевич

AU - Ayvazyan, Gagik Y.

AU - Гатапова, Елизавета Яковлевна

N1 - The study was supported by Russian Science Foundation (project 20-19-00722), characterization of the wetting properties of the black silicon was supported by the state contract with IT SB RAS (121031800213-0) on the KRUSS DSA-100E of large-scale research facilities “TGD complex IT SB RAS”

PY - 2022

Y1 - 2022

N2 - The dynamics of thin liquid drops evaporating from structured surfaces is of fundamental importance in the study of heat transfer from such surfaces. This work is devoted to the study of the thickness of a sessile water drop during evaporation from a solid substrate. Black silicon was used as a substrate, the average absorbance of which in the wavelength range of 300–750 nm is 94%. The change in the droplet thickness during evaporation was studied by the Schlieren method with a stepped filter. For this purpose, a method for processing the obtained schlieren images was developed and tested in MATLAB. This method makes it possible to calculate droplet profiles, their surface area and volume. Based on the data obtained, the specific mass flow rate from the liquid surface and the speed of the contact line were determined.

AB - The dynamics of thin liquid drops evaporating from structured surfaces is of fundamental importance in the study of heat transfer from such surfaces. This work is devoted to the study of the thickness of a sessile water drop during evaporation from a solid substrate. Black silicon was used as a substrate, the average absorbance of which in the wavelength range of 300–750 nm is 94%. The change in the droplet thickness during evaporation was studied by the Schlieren method with a stepped filter. For this purpose, a method for processing the obtained schlieren images was developed and tested in MATLAB. This method makes it possible to calculate droplet profiles, their surface area and volume. Based on the data obtained, the specific mass flow rate from the liquid surface and the speed of the contact line were determined.

KW - droplet

KW - evaporation

KW - profile

KW - schlieren method

UR - https://www.mendeley.com/catalogue/e2ed03b2-e85c-335e-af33-dd68c2264c12/

U2 - 10.1109/THERMINIC57263.2022.9950648

DO - 10.1109/THERMINIC57263.2022.9950648

M3 - Conference contribution

SN - 9781665492294

BT - 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

PB - Institute of Electrical and Electronics Engineers (IEEE)

ER -

ID: 55420284