Результаты исследований: Научные публикации в периодических изданиях › статья по материалам конференции › Рецензирование
Maximum heat fluxes and features of heat transfer mechanisms with boiling during jet impingement cooling of electronics. / Pukhovoy, M. V.; Kunts, K. A.; Spesivtsev, S. E. и др.
в: Journal of Physics: Conference Series, Том 1867, № 1, 012036, 19.04.2021.Результаты исследований: Научные публикации в периодических изданиях › статья по материалам конференции › Рецензирование
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TY - JOUR
T1 - Maximum heat fluxes and features of heat transfer mechanisms with boiling during jet impingement cooling of electronics
AU - Pukhovoy, M. V.
AU - Kunts, K. A.
AU - Spesivtsev, S. E.
AU - Kabov, O. A.
N1 - Funding Information: The study was performed under the support of Russian Foundation for Basic Research (Grant No. 19-08-01235). Publisher Copyright: © Published under licence by IOP Publishing Ltd. Copyright: Copyright 2021 Elsevier B.V., All rights reserved.
PY - 2021/4/19
Y1 - 2021/4/19
N2 - The needs of microelectronics for heat removal are growing and have already exceeded the value of 1 kW/cm2. To assess the ability of jet impingement cooling to meet the growing requirements, a review of experimental studies was conducted. The review demonstrated both the lack of progress in increasing critical heat flux value over the past 30 years, and the fact that this technique is still considered effective and promising. The review showed that the movement to intensify heat transfer is in the same direction as in other promising cooling technologies. It is noted that the most productive heat transfer occurs in the region of the thinnest liquid film spreading from a free impingement liquid jet. New fundamental studies are discussed that note the significance of heat transfer values in a very thin liquid film, and this is important for the development of cooling technologies. Problems are formulated for the required detailed studies of highly dynamic processes in the boiling region of an ultrafine liquid film at the micro level, aimed at intensifying heat transfer.
AB - The needs of microelectronics for heat removal are growing and have already exceeded the value of 1 kW/cm2. To assess the ability of jet impingement cooling to meet the growing requirements, a review of experimental studies was conducted. The review demonstrated both the lack of progress in increasing critical heat flux value over the past 30 years, and the fact that this technique is still considered effective and promising. The review showed that the movement to intensify heat transfer is in the same direction as in other promising cooling technologies. It is noted that the most productive heat transfer occurs in the region of the thinnest liquid film spreading from a free impingement liquid jet. New fundamental studies are discussed that note the significance of heat transfer values in a very thin liquid film, and this is important for the development of cooling technologies. Problems are formulated for the required detailed studies of highly dynamic processes in the boiling region of an ultrafine liquid film at the micro level, aimed at intensifying heat transfer.
UR - http://www.scopus.com/inward/record.url?scp=85104846587&partnerID=8YFLogxK
U2 - 10.1088/1742-6596/1867/1/012036
DO - 10.1088/1742-6596/1867/1/012036
M3 - Conference article
AN - SCOPUS:85104846587
VL - 1867
JO - Journal of Physics: Conference Series
JF - Journal of Physics: Conference Series
SN - 1742-6588
IS - 1
M1 - 012036
T2 - 16th All-Russian School-Conference of Young Scientists with International Participation on Actual Problems of Thermal Physics and Physical Hydrodynamics, APTPH XVI 2020
Y2 - 24 November 2020 through 27 November 2020
ER -
ID: 28498390