Interaction of advancing contact lines with defects on heated substrates

Standard

Interaction of advancing contact lines with defects on heated substrates. / Ajaev, Vladimir S.; Gatapova, Elizaveta Ya; Kabov, Oleg A.

в: Physical Review E, Том 101, № 2, 022801, 18.02.2020.

Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование

Harvard

Ajaev, VS, Gatapova, EY & Kabov, OA 2020, 'Interaction of advancing contact lines with defects on heated substrates', Physical Review E, Том. 101, № 2, 022801. https://doi.org/10.1103/PhysRevE.101.022801

APA

Ajaev, V. S., Gatapova, E. Y., & Kabov, O. A. (2020). Interaction of advancing contact lines with defects on heated substrates. Physical Review E, 101(2), [022801]. https://doi.org/10.1103/PhysRevE.101.022801

Vancouver

Ajaev VS, Gatapova EY, Kabov OA. Interaction of advancing contact lines with defects on heated substrates. Physical Review E. 2020 февр. 18;101(2):022801. doi: 10.1103/PhysRevE.101.022801

Author

Ajaev, Vladimir S. ; Gatapova, Elizaveta Ya ; Kabov, Oleg A. / Interaction of advancing contact lines with defects on heated substrates. в: Physical Review E. 2020 ; Том 101, № 2.

BibTeX

@article{6e3b6709de554f589434b65c8bbb409f,

title = "Interaction of advancing contact lines with defects on heated substrates",

abstract = "We consider an advancing contact line traveling over a region of locally modified wetting or thermal substrate properties. A lubrication-type model is developed to account for coupling of viscous flow, evaporation, surface tension, and disjoining pressure. Stick-slip-type behavior is found for a range of conditions as the contact line passes over the defect and explained by a temporary increase in the local stresses disrupting the liquid supply into the contact line region. A simple estimate of the degree of contact line slowdown is obtained and compared with the numerical simulation results. Tangential stresses arising from the action of the electric field on the interfacial changes are accounted for in our model; neglecting them would lead to an overprediction of the time of interaction between the contact line and the defect. Increasing the substrate temperature uniformly has little effect on contact line motion, but local increase of the temperature enhances the tendency of the contact line to be pulled back by the defect, an effect explained by the Marangoni stresses.",

keywords = "EVAPORATION, THIN, FLOW, DYNAMICS, FILMS, SIMULATION, STABILITY, DROPLET, LIQUIDS",

author = "Ajaev, {Vladimir S.} and Gatapova, {Elizaveta Ya} and Kabov, {Oleg A.}",

year = "2020",

month = feb,

day = "18",

doi = "10.1103/PhysRevE.101.022801",

language = "English",

volume = "101",

journal = "Physical Review E",

issn = "2470-0045",

publisher = "American Physical Society",

number = "2",

}

RIS

TY - JOUR

T1 - Interaction of advancing contact lines with defects on heated substrates

AU - Ajaev, Vladimir S.

AU - Gatapova, Elizaveta Ya

AU - Kabov, Oleg A.

PY - 2020/2/18

Y1 - 2020/2/18

N2 - We consider an advancing contact line traveling over a region of locally modified wetting or thermal substrate properties. A lubrication-type model is developed to account for coupling of viscous flow, evaporation, surface tension, and disjoining pressure. Stick-slip-type behavior is found for a range of conditions as the contact line passes over the defect and explained by a temporary increase in the local stresses disrupting the liquid supply into the contact line region. A simple estimate of the degree of contact line slowdown is obtained and compared with the numerical simulation results. Tangential stresses arising from the action of the electric field on the interfacial changes are accounted for in our model; neglecting them would lead to an overprediction of the time of interaction between the contact line and the defect. Increasing the substrate temperature uniformly has little effect on contact line motion, but local increase of the temperature enhances the tendency of the contact line to be pulled back by the defect, an effect explained by the Marangoni stresses.

AB - We consider an advancing contact line traveling over a region of locally modified wetting or thermal substrate properties. A lubrication-type model is developed to account for coupling of viscous flow, evaporation, surface tension, and disjoining pressure. Stick-slip-type behavior is found for a range of conditions as the contact line passes over the defect and explained by a temporary increase in the local stresses disrupting the liquid supply into the contact line region. A simple estimate of the degree of contact line slowdown is obtained and compared with the numerical simulation results. Tangential stresses arising from the action of the electric field on the interfacial changes are accounted for in our model; neglecting them would lead to an overprediction of the time of interaction between the contact line and the defect. Increasing the substrate temperature uniformly has little effect on contact line motion, but local increase of the temperature enhances the tendency of the contact line to be pulled back by the defect, an effect explained by the Marangoni stresses.

KW - EVAPORATION

KW - THIN

KW - FLOW

KW - DYNAMICS

KW - FILMS

KW - SIMULATION

KW - STABILITY

KW - DROPLET

KW - LIQUIDS

UR - http://www.scopus.com/inward/record.url?scp=85080058811&partnerID=8YFLogxK

U2 - 10.1103/PhysRevE.101.022801

DO - 10.1103/PhysRevE.101.022801

M3 - Article

C2 - 32168621

AN - SCOPUS:85080058811

VL - 101

JO - Physical Review E

JF - Physical Review E

SN - 2470-0045

IS - 2

M1 - 022801

ER -

ID: 23668460