Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование
Heat transfer during water boiling on black silicon surfaces of different morphologies. / Володин, Олег Александрович; Serdyukov, V. S.; Vyacheslavova, E. A. и др.
в: Thermophysics and Aeromechanics, Том 31, № 5, 09.2024, стр. 1097-1102.Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование
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TY - JOUR
T1 - Heat transfer during water boiling on black silicon surfaces of different morphologies
AU - Володин, Олег Александрович
AU - Serdyukov, V. S.
AU - Vyacheslavova, E. A.
AU - Baranov, A. I.
AU - Malakhov, I. P.
AU - Konev, S. V.
AU - Kosovskikh, I. A.
N1 - The work was financially supported by the Russian Science Foundation (Project No. 23-29-10092) and by the Government of the Novosibirsk Region (Agreement No. р-48).
PY - 2024/9
Y1 - 2024/9
N2 - The paper presents experimental data on the effect of morphology of the black silicon superhydrophilic surface structure fabricated by plasma-chemical etching on heat transfer during pool boiling of water. Silicon surfaces with homogeneous and hybrid microstructures are investigated. Heat transfer experiments were carried out on pre-selected microstructured surfaces with the best characteristics of capillary wicking. It is shown that the critical heat flux (CHF) for a surface with a hybrid structure is approximately three times higher than the CHF for a smooth silicon surface (660 kW/m2), reaching a value of 1914 kW/m2, while the CHF for a surface with a homogeneous structure exceeds the CHF for a smooth surface by the factor of 2.4, reaching a value of 1568 kW/m2. At that, the maximum recorded heat transfer coefficient (HTC) of the surface with a homogeneous capillary structure, on the contrary, is the highest (77 kW/(m2K)), almost twice exceeding the heat transfer coefficients for the unmodified surface in the region of moderate heat fluxes. The surface with a hybrid structure demonstrates a delay in boiling incipience when compared with the results for a smooth surface, but with a further increase in the heat flux it significantly exceeds the HTC for the smooth reference surface, ultimately reaching a maximum value of 45 kW/(m2K) in the pre-crisis region.
AB - The paper presents experimental data on the effect of morphology of the black silicon superhydrophilic surface structure fabricated by plasma-chemical etching on heat transfer during pool boiling of water. Silicon surfaces with homogeneous and hybrid microstructures are investigated. Heat transfer experiments were carried out on pre-selected microstructured surfaces with the best characteristics of capillary wicking. It is shown that the critical heat flux (CHF) for a surface with a hybrid structure is approximately three times higher than the CHF for a smooth silicon surface (660 kW/m2), reaching a value of 1914 kW/m2, while the CHF for a surface with a homogeneous structure exceeds the CHF for a smooth surface by the factor of 2.4, reaching a value of 1568 kW/m2. At that, the maximum recorded heat transfer coefficient (HTC) of the surface with a homogeneous capillary structure, on the contrary, is the highest (77 kW/(m2K)), almost twice exceeding the heat transfer coefficients for the unmodified surface in the region of moderate heat fluxes. The surface with a hybrid structure demonstrates a delay in boiling incipience when compared with the results for a smooth surface, but with a further increase in the heat flux it significantly exceeds the HTC for the smooth reference surface, ultimately reaching a maximum value of 45 kW/(m2K) in the pre-crisis region.
KW - black silicon
KW - boiling
KW - capillary wicking
KW - critical heat flux
KW - heat transfer
KW - modified heat transfer surfaces
UR - https://www.scopus.com/pages/publications/105010173969
UR - https://www.elibrary.ru/item.asp?id=80367769
UR - https://www.mendeley.com/catalogue/c3a02322-44a6-3c87-8c1c-648ad8d018fc/
U2 - 10.1134/S0869864324050184
DO - 10.1134/S0869864324050184
M3 - Article
VL - 31
SP - 1097
EP - 1102
JO - Thermophysics and Aeromechanics
JF - Thermophysics and Aeromechanics
SN - 0869-8643
IS - 5
ER -
ID: 68675141