Standard

Electrocrystallization of Cu, Sn, and Сu-Sn alloys from sulfate electrolytes in the presence of thiourea and N-octylpyridinium bromide: Experimental and computational studies. / Kasach, Aliaksandr A.; Kasprzhitskii, Anton; Kharytonau, Dzmitry S. и др.

в: Colloids and Surfaces A: Physicochemical and Engineering Aspects, Том 685, 133321, 24.03.2024.

Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование

Harvard

Kasach, AA, Kasprzhitskii, A, Kharytonau, DS, Pospelau, AV, Kurilo, II & Lazorenko, G 2024, 'Electrocrystallization of Cu, Sn, and Сu-Sn alloys from sulfate electrolytes in the presence of thiourea and N-octylpyridinium bromide: Experimental and computational studies', Colloids and Surfaces A: Physicochemical and Engineering Aspects, Том. 685, 133321. https://doi.org/10.1016/j.colsurfa.2024.133321

APA

Kasach, A. A., Kasprzhitskii, A., Kharytonau, D. S., Pospelau, A. V., Kurilo, I. I., & Lazorenko, G. (2024). Electrocrystallization of Cu, Sn, and Сu-Sn alloys from sulfate electrolytes in the presence of thiourea and N-octylpyridinium bromide: Experimental and computational studies. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 685, [133321]. https://doi.org/10.1016/j.colsurfa.2024.133321

Vancouver

Kasach AA, Kasprzhitskii A, Kharytonau DS, Pospelau AV, Kurilo II, Lazorenko G. Electrocrystallization of Cu, Sn, and Сu-Sn alloys from sulfate electrolytes in the presence of thiourea and N-octylpyridinium bromide: Experimental and computational studies. Colloids and Surfaces A: Physicochemical and Engineering Aspects. 2024 март 24;685:133321. doi: 10.1016/j.colsurfa.2024.133321

Author

Kasach, Aliaksandr A. ; Kasprzhitskii, Anton ; Kharytonau, Dzmitry S. и др. / Electrocrystallization of Cu, Sn, and Сu-Sn alloys from sulfate electrolytes in the presence of thiourea and N-octylpyridinium bromide: Experimental and computational studies. в: Colloids and Surfaces A: Physicochemical and Engineering Aspects. 2024 ; Том 685.

BibTeX

@article{f7aa6a12d0964bb884124279d28c9071,
title = "Electrocrystallization of Cu, Sn, and Сu-Sn alloys from sulfate electrolytes in the presence of thiourea and N-octylpyridinium bromide: Experimental and computational studies",
abstract = "Galvanic deposition of copper, tin and their alloys is widely used in microelectronics, printed circuit boards, anticorrosive and decorative finishing of products for various purposes. One of the main factors determining the structural and morphological characteristics of the deposited coatings is the value of cathodic polarization during the deposition, which depends on the presence of complexing ions and surfactants. Complexation is one of the most effective and widespread ways to increase the cathodic polarization, as well as the convergence of deposition potentials of copper and tin. In this work we studied the combined effect of thiourea and N-octylpyridinium bromide additives on the kinetics of Cu, Sn, and Cu-Sn electrocrystallization from sulfuric acid electrolytes. The combined presence of these additives allows obtaining homogeneous and fine-grained Cu-Sn coatings. The results of theoretical studies agree well with experimental data and show that the introduction of thiourea and N-octylpyridinium bromide leads to the inhibition of cathodic reduction of hydrated copper(II) and tin(II) ions.",
keywords = "Electrocrystallization, MD modeling, N-octylpyridinium bromide, Sulfuric acid electrolyte, Thiourea",
author = "Kasach, {Aliaksandr A.} and Anton Kasprzhitskii and Kharytonau, {Dzmitry S.} and Pospelau, {Andrei V.} and Kurilo, {Irina I.} and Georgy Lazorenko",
note = "The reported study was funded by RFBR and BRFBR , project number 20-53-04012 and the Republic of Belarus Foundation for Basic Research (no. 20213135 ).",
year = "2024",
month = mar,
day = "24",
doi = "10.1016/j.colsurfa.2024.133321",
language = "English",
volume = "685",
journal = "Colloids and Surfaces A: Physicochemical and Engineering Aspects",
issn = "0927-7757",
publisher = "Elsevier",

}

RIS

TY - JOUR

T1 - Electrocrystallization of Cu, Sn, and Сu-Sn alloys from sulfate electrolytes in the presence of thiourea and N-octylpyridinium bromide: Experimental and computational studies

AU - Kasach, Aliaksandr A.

AU - Kasprzhitskii, Anton

AU - Kharytonau, Dzmitry S.

AU - Pospelau, Andrei V.

AU - Kurilo, Irina I.

AU - Lazorenko, Georgy

N1 - The reported study was funded by RFBR and BRFBR , project number 20-53-04012 and the Republic of Belarus Foundation for Basic Research (no. 20213135 ).

PY - 2024/3/24

Y1 - 2024/3/24

N2 - Galvanic deposition of copper, tin and their alloys is widely used in microelectronics, printed circuit boards, anticorrosive and decorative finishing of products for various purposes. One of the main factors determining the structural and morphological characteristics of the deposited coatings is the value of cathodic polarization during the deposition, which depends on the presence of complexing ions and surfactants. Complexation is one of the most effective and widespread ways to increase the cathodic polarization, as well as the convergence of deposition potentials of copper and tin. In this work we studied the combined effect of thiourea and N-octylpyridinium bromide additives on the kinetics of Cu, Sn, and Cu-Sn electrocrystallization from sulfuric acid electrolytes. The combined presence of these additives allows obtaining homogeneous and fine-grained Cu-Sn coatings. The results of theoretical studies agree well with experimental data and show that the introduction of thiourea and N-octylpyridinium bromide leads to the inhibition of cathodic reduction of hydrated copper(II) and tin(II) ions.

AB - Galvanic deposition of copper, tin and their alloys is widely used in microelectronics, printed circuit boards, anticorrosive and decorative finishing of products for various purposes. One of the main factors determining the structural and morphological characteristics of the deposited coatings is the value of cathodic polarization during the deposition, which depends on the presence of complexing ions and surfactants. Complexation is one of the most effective and widespread ways to increase the cathodic polarization, as well as the convergence of deposition potentials of copper and tin. In this work we studied the combined effect of thiourea and N-octylpyridinium bromide additives on the kinetics of Cu, Sn, and Cu-Sn electrocrystallization from sulfuric acid electrolytes. The combined presence of these additives allows obtaining homogeneous and fine-grained Cu-Sn coatings. The results of theoretical studies agree well with experimental data and show that the introduction of thiourea and N-octylpyridinium bromide leads to the inhibition of cathodic reduction of hydrated copper(II) and tin(II) ions.

KW - Electrocrystallization

KW - MD modeling

KW - N-octylpyridinium bromide

KW - Sulfuric acid electrolyte

KW - Thiourea

UR - https://www.scopus.com/record/display.uri?eid=2-s2.0-85184011637&origin=inward&txGid=882b5a292555ff7ef90b7996cb29f9cd

UR - https://www.mendeley.com/catalogue/886c2782-897a-3e93-bc9c-495292ede161/

U2 - 10.1016/j.colsurfa.2024.133321

DO - 10.1016/j.colsurfa.2024.133321

M3 - Article

VL - 685

JO - Colloids and Surfaces A: Physicochemical and Engineering Aspects

JF - Colloids and Surfaces A: Physicochemical and Engineering Aspects

SN - 0927-7757

M1 - 133321

ER -

ID: 61085841