Результаты исследований: Научные публикации в периодических изданиях › обзорная статья › Рецензирование
Cooling of high-power LEDs by liquid sprays : Challenges and prospects. / Khandekar, Sameer; Sahu, Gopinath; Muralidhar, K. и др.
в: Applied Thermal Engineering, Том 184, 115640, 05.02.2021.Результаты исследований: Научные публикации в периодических изданиях › обзорная статья › Рецензирование
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TY - JOUR
T1 - Cooling of high-power LEDs by liquid sprays
T2 - Challenges and prospects
AU - Khandekar, Sameer
AU - Sahu, Gopinath
AU - Muralidhar, K.
AU - Gatapova, Elizaveta Ya
AU - Kabov, Oleg A.
AU - Hu, Run
AU - Luo, Xiaobing
AU - Zhao, Liang
N1 - Publisher Copyright: © 2020 Elsevier Ltd Copyright: Copyright 2021 Elsevier B.V., All rights reserved.
PY - 2021/2/5
Y1 - 2021/2/5
N2 - Light Emitting Diodes (LEDs) are getting popular due to their wide applicability in various domestic and industrial applications. However, the advent of high-power LEDs is accompanied with the critical issue of higher heat power management, coupled with enhanced flux levels. Natural and forced convection techniques with air as the working fluid are unable to provide thermal management at required operating safe temperatures in several upcoming compact LED array designs. Hence, there is substantial advancement in the development of thermal management solutions for the packaging of high-power LEDs. Liquid jets and sprays are potential candidates which need further exploration, especially from a point of view of packaging with LED modules. Both configurations can operate in single-phase and two-phase boiling regimes. While considerable literature is available on single-phase liquid jets, liquid sprays pose several challenges in terms of flow parameter management and associated transport physics. In this paper, we review nuances of the latter technology, i.e., spray cooling technique, crucial for thermal management of LEDs. A comprehensive overview of flow distribution and heat transfer during impingement of liquid sprays on heated surfaces is presented from the viewpoint of temperature control of high power LED sources. Additionally, the data presented will help in developing a configuration design of a liquid spray-based thermal management system integrated with high heat flux devices.
AB - Light Emitting Diodes (LEDs) are getting popular due to their wide applicability in various domestic and industrial applications. However, the advent of high-power LEDs is accompanied with the critical issue of higher heat power management, coupled with enhanced flux levels. Natural and forced convection techniques with air as the working fluid are unable to provide thermal management at required operating safe temperatures in several upcoming compact LED array designs. Hence, there is substantial advancement in the development of thermal management solutions for the packaging of high-power LEDs. Liquid jets and sprays are potential candidates which need further exploration, especially from a point of view of packaging with LED modules. Both configurations can operate in single-phase and two-phase boiling regimes. While considerable literature is available on single-phase liquid jets, liquid sprays pose several challenges in terms of flow parameter management and associated transport physics. In this paper, we review nuances of the latter technology, i.e., spray cooling technique, crucial for thermal management of LEDs. A comprehensive overview of flow distribution and heat transfer during impingement of liquid sprays on heated surfaces is presented from the viewpoint of temperature control of high power LED sources. Additionally, the data presented will help in developing a configuration design of a liquid spray-based thermal management system integrated with high heat flux devices.
KW - Droplet impingement
KW - LEDs
KW - Spray cooling
KW - Thermal management
KW - BOILING REGIMES
KW - THERMAL MANAGEMENT
KW - IMPINGEMENT
KW - FLUX
KW - DROP IMPACT
KW - WATER SPRAY
KW - SINGLE-PHASE
KW - PART 1
KW - HEAT-TRANSFER CHARACTERISTICS
KW - LIGHT-EMITTING DIODE
UR - http://www.scopus.com/inward/record.url?scp=85097787459&partnerID=8YFLogxK
UR - https://www.mendeley.com/catalogue/cbe2dcef-a168-3caf-8f27-369781b1d2d9/
U2 - 10.1016/j.applthermaleng.2020.115640
DO - 10.1016/j.applthermaleng.2020.115640
M3 - Review article
AN - SCOPUS:85097787459
VL - 184
JO - Applied Thermal Engineering
JF - Applied Thermal Engineering
SN - 1359-4311
M1 - 115640
ER -
ID: 27118714