Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование
Contact method for simultaneous measuring the liquid film thickness and temperature. / Gatapova, Elizaveta Ya; Filipenko, Maxim A.; Aniskin, Vladimir M. и др.
в: Interfacial Phenomena and Heat Transfer, Том 6, № 3, 01.01.2018, стр. 187-196.Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование
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TY - JOUR
T1 - Contact method for simultaneous measuring the liquid film thickness and temperature
AU - Gatapova, Elizaveta Ya
AU - Filipenko, Maxim A.
AU - Aniskin, Vladimir M.
AU - Kabov, Oleg A.
PY - 2018/1/1
Y1 - 2018/1/1
N2 - We present a contact method for local measurements of liquid film thickness and temperature. The sensing element is a microthermocouple with flat bead working on the Seebeck effect. The bead size of the manufactured thermocouple is less than 3 _m. A special software is developed which synchronizes microthermocouple readings and the motorized stage position, allowing automatic determination of the thickness of the liquid layer. The interface position is determined as a position of abrupt change in temperature. In some cases this measured temperature difference corresponds to the temperature jump value. In the case of the absence of a temperature difference, the interface position is determined from the difference in temperature gradients, from the so-called fracture of the temperature profile at the interface that occurs due to the difference in thermal conductivity between the gas and the liquid. Four different types of liquid, H2O, C2H5OH, CH2I2, and HFE-7100, are used in the experiments. This technique simultaneously provides data on the local film thickness and temperature profile, including the temperature value at the liquid-gas interface, using one instrument. Our measurements are in excellent agreement with the measurements by the shadow method. The method can be adopted for measurements of void fraction in two-phase flow. In the case of the existence of measurable temperature jump the thermal resistance of the liquid-gas interface can be estimated.
AB - We present a contact method for local measurements of liquid film thickness and temperature. The sensing element is a microthermocouple with flat bead working on the Seebeck effect. The bead size of the manufactured thermocouple is less than 3 _m. A special software is developed which synchronizes microthermocouple readings and the motorized stage position, allowing automatic determination of the thickness of the liquid layer. The interface position is determined as a position of abrupt change in temperature. In some cases this measured temperature difference corresponds to the temperature jump value. In the case of the absence of a temperature difference, the interface position is determined from the difference in temperature gradients, from the so-called fracture of the temperature profile at the interface that occurs due to the difference in thermal conductivity between the gas and the liquid. Four different types of liquid, H2O, C2H5OH, CH2I2, and HFE-7100, are used in the experiments. This technique simultaneously provides data on the local film thickness and temperature profile, including the temperature value at the liquid-gas interface, using one instrument. Our measurements are in excellent agreement with the measurements by the shadow method. The method can be adopted for measurements of void fraction in two-phase flow. In the case of the existence of measurable temperature jump the thermal resistance of the liquid-gas interface can be estimated.
KW - Evaporation
KW - Liquid film thickness
KW - Liquid-gas interface
KW - Microthermocouple
KW - Temperature jump
KW - Temperature measurements
KW - Thermal resistance
KW - Void fraction
KW - microthermocouple
KW - temperature measurements
KW - void fraction
KW - FLOW
KW - thermal resistance
KW - INTERFACE
KW - liquid film thickness
KW - temperature jump
KW - liquid-gas interface
KW - evaporation
KW - WATER
UR - http://www.scopus.com/inward/record.url?scp=85068687143&partnerID=8YFLogxK
U2 - 10.1615/InterfacPhenomHeatTransfer.2018029685
DO - 10.1615/InterfacPhenomHeatTransfer.2018029685
M3 - Article
AN - SCOPUS:85068687143
VL - 6
SP - 187
EP - 196
JO - Interfacial Phenomena and Heat Transfer
JF - Interfacial Phenomena and Heat Transfer
SN - 2169-2785
IS - 3
ER -
ID: 20826108