Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Research › peer-review
The Method to Inspect Ball- Type Wire Bonding in a Non-Destructive Testing System for Integrated Circuits. / Golitsyn, Alexandr A.; Seyfi, Natalia A.; Golitsyn, Sergei A.
Proceedings of the IEEE 3rd International Conference on Problems of Informatics, Electronics and Radio Engineering, PIERE 2024. Institute of Electrical and Electronics Engineers Inc., 2024. p. 620-624.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Research › peer-review
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TY - GEN
T1 - The Method to Inspect Ball- Type Wire Bonding in a Non-Destructive Testing System for Integrated Circuits
AU - Golitsyn, Alexandr A.
AU - Seyfi, Natalia A.
AU - Golitsyn, Sergei A.
N1 - Conference code: 3
PY - 2024
Y1 - 2024
N2 - The article presents the results of applying the method of computing the cross-correlation values to find the object of a given shape in the image and to compute its location and its size. In order to process the calculations, the function of normalized cross-correlation is applied to the source image and the several image patterns containing different size solid shapes of searched objects. The task is simplified for round objects due to their central symmetry. The article provides a clear example how to prepare the inspected image before applying the correlation function and how to interpret the results of the function. The feasibility and practical applicability of the proposed method is shown by the example of an algorithm for analyzing ball-type wire bonding to the surface of semiconductor dies widely used in integrated circuits fabrication. The algorithm can be used for non-destructive testing purposes in the production of semiconductor products before their packaging. The algorithm allows not only to measure the ball's diameter and its coordinate and to determine if both ones are in tolerance or not, but also to determine whether the connection itself exists or not.
AB - The article presents the results of applying the method of computing the cross-correlation values to find the object of a given shape in the image and to compute its location and its size. In order to process the calculations, the function of normalized cross-correlation is applied to the source image and the several image patterns containing different size solid shapes of searched objects. The task is simplified for round objects due to their central symmetry. The article provides a clear example how to prepare the inspected image before applying the correlation function and how to interpret the results of the function. The feasibility and practical applicability of the proposed method is shown by the example of an algorithm for analyzing ball-type wire bonding to the surface of semiconductor dies widely used in integrated circuits fabrication. The algorithm can be used for non-destructive testing purposes in the production of semiconductor products before their packaging. The algorithm allows not only to measure the ball's diameter and its coordinate and to determine if both ones are in tolerance or not, but also to determine whether the connection itself exists or not.
KW - ball-type wire bonding
KW - cross-correlation
KW - image processing
KW - image recognition
KW - semiconductor products diagnostics
UR - https://www.scopus.com/record/display.uri?eid=2-s2.0-85216576411&origin=inward&txGid=9d5fec4c6ca9071c75585fd5de9b379c
UR - https://www.mendeley.com/catalogue/d3441695-685f-37c8-95d8-498e0ddbcaa9/
U2 - 10.1109/PIERE62470.2024.10805006
DO - 10.1109/PIERE62470.2024.10805006
M3 - Conference contribution
SN - 979-8-3315-1633-8
SP - 620
EP - 624
BT - Proceedings of the IEEE 3rd International Conference on Problems of Informatics, Electronics and Radio Engineering, PIERE 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd IEEE International Conference on Problems of Informatics, Electronics and Radio Engineering
Y2 - 15 November 2024 through 17 November 2024
ER -
ID: 64587963