Original language | English |
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Title of host publication | 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
Number of pages | 4 |
ISBN (Print) | 9781665492294 |
DOIs | |
Publication status | Published - 2022 |
Externally published | Yes |
ID: 55420284