Original languageEnglish
Title of host publication28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages4
ISBN (Print)9781665492294
DOIs
Publication statusPublished - 2022
Externally publishedYes

    Research areas

  • droplet, evaporation, profile, schlieren method

    OECD FOS+WOS

  • 1.03 PHYSICAL SCIENCES AND ASTRONOMY

ID: 55420284