TY - JOUR

T1 - Extreme heat fluxes and heat transfer mechanisms during electronics spray and jet impingement cooling with boiling

AU - Pukhovoy, M. V.

AU - Bykovskaya, E. A.

AU - Kabov, O. A.

N1 - Funding Information: The study was performed under the support of Russian Foundation for Basic Research (Grant No. 19-08-01235). Publisher Copyright: © 2020 Institute of Physics Publishing. All rights reserved. Copyright: Copyright 2020 Elsevier B.V., All rights reserved.

PY - 2020/12/3

Y1 - 2020/12/3

N2 - Microelectronics already needs for heat removal more than 1 kW/cm2. To assess the spray cooling capabilities to meet the growing requirements, a review of experimental studies is presented. Both the lack of progress in increasing the limit values of critical heat fluxes over the past 20-30 years and the fact that this technique is considered effective and promising are demonstrated. The "modern" physical picture has been formed at the turn of the 21st century. The review shows that the trend towards increasing the heat transfer coefficients is realized in the same way as in other promising cooling technologies. The paper refers to the studies in which the coolant film thickness was reduced by the authors, as well as those that presented correlations of the three-phase contact line dynamics with the values of the achieved heat flux. A problem is formulated for the required detailed studies of highly dynamic processes in an ultra-thin liquid film at the micro level, aimed at the heat transfer enhancement.

AB - Microelectronics already needs for heat removal more than 1 kW/cm2. To assess the spray cooling capabilities to meet the growing requirements, a review of experimental studies is presented. Both the lack of progress in increasing the limit values of critical heat fluxes over the past 20-30 years and the fact that this technique is considered effective and promising are demonstrated. The "modern" physical picture has been formed at the turn of the 21st century. The review shows that the trend towards increasing the heat transfer coefficients is realized in the same way as in other promising cooling technologies. The paper refers to the studies in which the coolant film thickness was reduced by the authors, as well as those that presented correlations of the three-phase contact line dynamics with the values of the achieved heat flux. A problem is formulated for the required detailed studies of highly dynamic processes in an ultra-thin liquid film at the micro level, aimed at the heat transfer enhancement.

UR - http://www.scopus.com/inward/record.url?scp=85097348841&partnerID=8YFLogxK

U2 - 10.1088/1742-6596/1677/1/012150

DO - 10.1088/1742-6596/1677/1/012150

M3 - Conference article

AN - SCOPUS:85097348841

VL - 1677

JO - Journal of Physics: Conference Series

JF - Journal of Physics: Conference Series

SN - 1742-6588

IS - 1

M1 - 012150

T2 - 36th Siberian Thermophysical Seminar, STS 2020

Y2 - 5 October 2020 through 7 October 2020

ER -