Original languageEnglish
Pages (from-to)187-196
Number of pages10
JournalInterfacial Phenomena and Heat Transfer
Volume6
Issue number3
DOIs
Publication statusPublished - 1 Jan 2018

    OECD FOS+WOS

    Research areas

  • Evaporation, Liquid film thickness, Liquid-gas interface, Microthermocouple, Temperature jump, Temperature measurements, Thermal resistance, Void fraction, microthermocouple, temperature measurements, void fraction, FLOW, thermal resistance, INTERFACE, liquid film thickness, temperature jump, liquid-gas interface, evaporation, WATER

ID: 20826108