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Asymptotic modelling of bonded plates by a soft thin adhesive layer. / Rudoy, E. M.

In: Сибирские электронные математические известия, Vol. 17, 2020, p. 615-625.

Research output: Contribution to journalArticlepeer-review

Harvard

Rudoy, EM 2020, 'Asymptotic modelling of bonded plates by a soft thin adhesive layer', Сибирские электронные математические известия, vol. 17, pp. 615-625. https://doi.org/10.33048/semi.2020.17.040

APA

Rudoy, E. M. (2020). Asymptotic modelling of bonded plates by a soft thin adhesive layer. Сибирские электронные математические известия, 17, 615-625. https://doi.org/10.33048/semi.2020.17.040

Vancouver

Rudoy EM. Asymptotic modelling of bonded plates by a soft thin adhesive layer. Сибирские электронные математические известия. 2020;17:615-625. doi: 10.33048/semi.2020.17.040

Author

Rudoy, E. M. / Asymptotic modelling of bonded plates by a soft thin adhesive layer. In: Сибирские электронные математические известия. 2020 ; Vol. 17. pp. 615-625.

BibTeX

@article{b7f8c07cb89c4025bcc1e7d303515bac,
title = "Asymptotic modelling of bonded plates by a soft thin adhesive layer",
abstract = "In the present paper, a composite structure is considered. The structure is made of three homogeneous plates: two linear elastic adherents and a thin adhesive. It is assumed that elastic properties of the adhesive layer depend on its thickness {"}as{"} to the power of 3. Passage to the limit as {"} goes to zero is justified and a limit model is found in which the influence of the thin adhesive layer is replaced by an interface condition between adherents. As a result, we have analog of the spring type condition in the plate theory. Moreover, a representation formula of the solution in the adhesive layer has been obtained.",
keywords = "Biharmonic equation, Bonded structure, Composite material, Kirchhoff-Love's plate, Spring type interface condition, biharmonic equation, INTERFACES, bonded structure, composite material, spring type interface condition",
author = "Rudoy, {E. M.}",
year = "2020",
doi = "10.33048/semi.2020.17.040",
language = "English",
volume = "17",
pages = "615--625",
journal = "Сибирские электронные математические известия",
issn = "1813-3304",
publisher = "Sobolev Institute of Mathematics",

}

RIS

TY - JOUR

T1 - Asymptotic modelling of bonded plates by a soft thin adhesive layer

AU - Rudoy, E. M.

PY - 2020

Y1 - 2020

N2 - In the present paper, a composite structure is considered. The structure is made of three homogeneous plates: two linear elastic adherents and a thin adhesive. It is assumed that elastic properties of the adhesive layer depend on its thickness "as" to the power of 3. Passage to the limit as " goes to zero is justified and a limit model is found in which the influence of the thin adhesive layer is replaced by an interface condition between adherents. As a result, we have analog of the spring type condition in the plate theory. Moreover, a representation formula of the solution in the adhesive layer has been obtained.

AB - In the present paper, a composite structure is considered. The structure is made of three homogeneous plates: two linear elastic adherents and a thin adhesive. It is assumed that elastic properties of the adhesive layer depend on its thickness "as" to the power of 3. Passage to the limit as " goes to zero is justified and a limit model is found in which the influence of the thin adhesive layer is replaced by an interface condition between adherents. As a result, we have analog of the spring type condition in the plate theory. Moreover, a representation formula of the solution in the adhesive layer has been obtained.

KW - Biharmonic equation

KW - Bonded structure

KW - Composite material

KW - Kirchhoff-Love's plate

KW - Spring type interface condition

KW - biharmonic equation

KW - INTERFACES

KW - bonded structure

KW - composite material

KW - spring type interface condition

UR - http://www.scopus.com/inward/record.url?scp=85091378524&partnerID=8YFLogxK

U2 - 10.33048/semi.2020.17.040

DO - 10.33048/semi.2020.17.040

M3 - Article

AN - SCOPUS:85091378524

VL - 17

SP - 615

EP - 625

JO - Сибирские электронные математические известия

JF - Сибирские электронные математические известия

SN - 1813-3304

ER -

ID: 25678759